Thermal Grade Large-Area Substrate

Our thermal-grade diamond products & devices are designed to maximize heat spreading and mechanical stability in high-power and high-frequency environments.

They enhance performance and reliability in:

  • Power electronics
  • RF and microwave systems
  • Wide-bandgap semiconductor platforms
  • High-density integrated chips

With exceptional thermal conductivity, and structural robustness, these substrates improve efficiency, lifetime, and system reliability in next-generation electronics systems.

Available as: single-crystal plates with customizable dimensions, thickness and surface finishes.

Advanced Post-Processing Services Available: metallization, advanced integration features.

SKU: S-T-0A00-0000
Dimensions: Up to 17mm x 17mm
Thickness: 0.5mm
Single-crystal CVD
Face Orientation: <100>
Roughness: <9nm Ra

*Free 1-hour Technical Consultation included

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