Advanced Packaging Applications
Single-crystal diamond thermal materials for applications where junction temperature determines performance, reliability, and lifetime.
The Challenge
Advanced packaging has outpaced conventional thermal management
2.5D interposers, 3D die stacks, and chiplet architectures have packed more power into less space than the packages they replaced. That density gain has a cost: heat now has less distance to travel before it becomes the limiting factor in a design.
As junction temperatures rise, so do failure rates, derating margins, and long-term reliability risk. This is a materials constraint, and it requires a materials-level solution.
The Solution
When single-crystal diamond is the right choice
Single-crystal diamond is the right choice when the cost of thermal failure outweighs the material premium.
- Derated performance
- Shortened lifetime
- Decreasing Field returns
Recent advances in wafer-scale single-crystal production are also expanding where it makes economic sense.
GLCT single-crystal diamond thermal products
Applications
